DK7-20H and DK15EG-05: Best affordability and productivity 
The auto industry is hyper-competitive, pushing their factories for maximum productivity while pushing their suppliers for lower prices. SolEpoxy rose to this challenge with two of the world's most productive and affordable motor armature coating powders.
SolEpoxy coating powder technology 
SolEpoxy produces a range of fusion bonded epoxy powder coatings that provide environmental protection and electrical insulation in many power electrical applications.
Advantages of Epoxy Coating Powder over Mylar Sleeves 
Low & medium voltage busbars can be electrical insulated using either mylar sleeves or epoxy coating powder. Epoxy coating powder provides the following benefits over mylar:
  • It costs less than plastic per linear foot/meter
  • Epoxy has higher operating temperature
  • Epoxy can be used on Odd Shaped Parts
Epoxy Molding Compound with Very Low Coefficient of Thermal Expansion (CTE) 
MG30 offers unique features:
  • CTE of 8ppm/C
  • Incredible chemical resistance
  • High temperature operation
SolEpoxy presents MH20-01 for Injection molding applications up to 220C 
Injection molding applications require a mold compound with low viscosity, long spiral flow, fast cure time and high hot hardness.
MH20-2000: Strong like steel, light as plastic 
Why use steel when you can use a thermoset epoxy that is as strong as steel, but light as plastic.

SolEpoxy presents MH20-2000, a very tough epoxy mold compound that has nearly the same strength as steel, but with lighter weight.
MH7-1: Strong like steel; Insulates like epoxy. 
MH7-1 combines the best of three worlds:
  • The homogeneous strength of steel
  • The light-weight of fiberglass
  • The insulating power of epoxy
MH7-1 is a fine, homogeneous molding compound that yields isotropic strength through both compression molding and transfer molding. It is capable of filling complex mold shapes and encapsulating small electronic components.
MH6-0510 Very tough, high thermal shock epoxy mold compound for solenoids, coil bobbins, and transformers 
MH6-0510 is very tough epoxy mold
compound with excellent thermal shock and themal
cycle resistance.
OP1000 Heat and UV-resistant, optically clear molding compound for RBG devices and backlighting 
  • Resists yellowing up to 125C for thousands of hours
  • Glass transition temperature (Tg) > 135C
  • Diffused, colored and light filtering versions
OC10-1 Heat-resistant, optically-clear molding compound for RBG devices & BLU 
  • Resists yellowing up to 125C for thousands of hours
  • Refractive index of 1.53 @ 400 nm
  • Excellent transmittance from 400 to 1400 nm
OL10-1 High refractive index liquid encapsulant for optoelectronic devices 
  • Outstanding resistance to yellowing after heat aging up to 105C
  • Suitable for through-hole, SMT, and MAP style packages
  • Can be used to replace expensive bandpass filters
OP1000 Heat and UV-resistant, optically clear molding compound for RBG devices and backlighting 
  • Resists yellowing up to 125C for thousands of hours
  • Glass transition temperature (Tg) > 135C
  • Diffused, colored and light filtering versions
HB2000 White reflective molding compound for LEDs 
HB2000 is a high temperature epoxy molding compound developed as an alternative to thermoplastics for LEDs rated at ~1 watt or more. It is designed for molded lead frame reflector packages in LED backlighting units (BLU) for liquid crystal displays and for general lighting applications.
MH7-1 
MH7-1 is a very tough, high-operating-temperature epoxy mold compound for harsh environment applications.
MH20-2000 Very tough, high operating temperature epoxy mold compound for power resistors, switches, fuses, actuators, and explosion proof housings 
MH20-2000 is a very tough epoxy mold
compound with excellent high temperature resistance.
It is used in applications that require thermoset
epoxies instead of thermoplastics because of higher
performance requirements.
MG6-0330 Tough, high thermal shock epoxy mold compound for large bushings and other high voltage applications 
MG6-0330 is very tough epoxy mold compound with excellent thermal shock and thermal cycle resistance.
OL10-1 High refractive index liquid encapsulant for optoelectronic devices 
  • Outstanding resistance to yellowing after heat aging up to 105C
  • Suitable for through-hole, SMT, and MAP style packages
  • Can be used to replace expensive bandpass filters
OP1000 Heat and UV-resistant, optically clear molding compound for RBG devices and backlighting 
  • Resists yellowing up to 125C for thousands of hours
  • Glass transition temperature (Tg) > 135C
  • Diffused, colored and light filtering versions
OL88-8 High refractive index liquid encapsulant for optoelectronic devices 
OL88-8 is an ultra-clear hybrid liquid encapsulant developed specifically for outdoor RGB displays. It is uniquely suited for RGB SMT devices due to its very high adhesion to black-faced PPA packages and very low moisture absorption, able to pass -65C to 150C temperature shock cycles and 85C / 85% RH + 3x 260C reflow required for outdoor RGB SMT displays.
OP1000 Heat and UV-resistant, optically clear molding compound for RBG devices and backlighting 
  • Resists yellowing up to 125C for thousands of hours
  • Glass transition temperature (Tg) > 135C
  • Diffused, colored and light filtering versions