About Us 
Describe SolEpoxy
AL10-1 One-part epoxy solution to stainless steel brazing 

Key Application Considerations:

  • Very high adhesion to stainless steel and other metals
  • Balanced flow to get between joints yet not flow off
    them
  • CTE-matched to the substrates involved
MH20-01 Black Very tough, high operating temperature epoxy mold compound for power resistors, switches, fuses, actuators, and explosion proof housings 
MH20-01 is a very tough epoxy mold compound with excellent high temperature resistance. It is used in applications that use thermoset plastics instead of thermoplastics because of the high temperature requirements
MH20-01 Gold Very tough, high operating temperature epoxy mold compound for power resistors, switches, fuses, actuators, and explosion proof housings 
MH20-01 is a very tough epoxy mold compound with excellent high temperature resistance. It is used in applications that use thermoset plastics instead of thermoplastics because of the high temperature requirements.
MH20-0686 Black Epoxy Molding Compound 
MH20-0686 is a very tough epoxy mold compound with excellent high temperature resistance. It is used in applications that use thermoset plastics instead of thermoplastics because of the high temperature requirements.
MG33-0690 Black Epoxy Mold Compound 
MG33-0690 Fast cure, solvent resistant compound with superior copper adhesion for engine gear tooth and other automotive sensors
Busbar Patch Kits 
  • High dielectric strength
  • Applied as a liquid at room temperature
  • Color-matches the epoxy coating powder used
Adhesive Alternative to Brazing 
  • Very high adhesion to stainless steel and other metals
  • Balanced flow to get between joints yet not flow off them
  • CTE-matched to the substrates involved
MH20-0686 Black Epoxy Molding Compound 
MH20-0686 is a very tough epoxy mold compound with excellent high temperature resistance. It is used in applications that use thermoset plastics instead of thermoplastics because of the high temperature requirements.
MG33-0690 Black Epoxy Mold Compound 
MG33-0690 Fast cure, solvent resistant compound with superior copper adhesion for engine gear tooth and other automotive sensors
Certifications 
List different Certifications
OC10-1 Heat-resistant, optically-clear molding compound for RBG devices & BLU 
  • Resists yellowing up to 125C for thousands of hours
  • Refractive index of 1.53 @ 400 nm
  • Excellent transmittance from 400 to 1400 nm
OL10-1 High refractive index liquid encapsulant for optoelectronic devices 
  • Outstanding resistance to yellowing after heat aging up to 105C
  • Suitable for through-hole, SMT, and MAP style packages
  • Can be used to replace expensive bandpass filters
OP1000 Heat and UV-resistant, optically clear molding compound for RBG devices and backlighting 
  • Resists yellowing up to 125C for thousands of hours
  • Glass transition temperature (Tg) > 135C
  • Diffused, colored and light filtering versions
OP7000 Clear molding compound for SMT light sensors and emitters 
  • Single-Mold Data Transmission Sensors
  • Excellent light transmission even after aging
  • Excellent MSL performance for single-mold devices
OP7200 Clear molding compound for MAP light sensors and emitters 
  • Optimized for leadframe & laminate-based MAP style packages
  • Excellent transmittance from 400 to 1600 nm
  • Excellent resistance to yellowing after heat aging
SMT Backlighting Units (BLU) 
Backlighting units are all around us today. Not a single smartphone or tablet could ship without them and they are the lighting methods used by all LED televisions.

SolEpoxy has developed a range of optically clear liquids that are best in class in yellow-resistance. These materials can withstand 1000's of hours @ 105C without little degradation.
OG10-1 Heat and UV-resistant, optically-clear molding compound for RBG devices and backlighting 
OG10-1 is a non-yellowing clear molding compound for the encapsulation of optoelectronic devices. It features high transmittance from under 400nm to 1600nm, high refractive index and cures to form a hard, non-tacky encapsulant with low gas permeability. It may be used as a cost-effective silicone alternative with similar light output for LEDs.
SolEpoxy introduces OP50-2 for next-generation optoelectronics encapsulation 
OP50-2 offers unique features:
  • MSL1-capable clear mold compound
  • 40% less water absorption than industry standard
  • 40% lower CTE than OP7000
SolEpoxy introduces DK52 Orange epoxy insulation for electric vehicles 
DK52 ORANGE offers unique features:
  • Extremely high dielectric strength
  • Flexible when cured
  • Impermeable to water and durable against automotive fluids