SolEpoxy introduces OP50-2 for next-generation optoelectronics encapsulation

SolEpoxy is proud to introduce the newest addition to our line of optically clear encapsulants:
SolEpoxy OP50-2,a low-stress, high clarity, MSL1-capable clear molding compound!

OP50-2 is a transparent epoxy molding compound, formulated specifically for improved MSL (Moisture Sensitivity Level for reflow soldering) of optical devices in SMT packages. OP50-2 was developed to achieve MSL1 and other aggressive soldering standards, while maintaining the excellent transmission and anti-yellowing characteristics of OP7000.

MSL 1 performance

MSL 1 performance is achieved with over 40% reduction in moisture absorption and CTE, compared with OP7000. OP50-2 shows just 0.19% weight moisture absorption after a one hour water boil, and CTE alpha 1 of just 42 ppm per degree Celsius.

Figure 1: Moisture Absorption and CTE are 40% less compared to industry standard OP7000

Lower warpage for Molded Array Packages (MAP)

Dramatic reduction in thermal expansion also drives lower cure shrinkage and warpage, enhancing yields and throughput for array packages molded in strip or panel form.

Improved temperature cycling

High adhesion and low thermal expansion help to protect fragile wire-bonds from breaking during temperature cycling, such as automotive or other harsh environments.


OP50-2 is the first of a family of low stress optical compounds. Contact us about your special requirements.A low stress liquid compound is coming soon. In addition, colored and light-filtering variants are available to customers who need to encapsulate high-contrast LEDs, IR devices, and ambient light sensors.

Don’t Sacrifice Optical Clarity

This technology solves the MSL problem without sacrificing clarity, typically measured as light transmittance. Internal transmittance of thin sections is maintained at up to 98% throughout the visible spectrum, and even up to 1000nm.

Customer Processing

The material demonstrates good adhesion to NiPdAu, silver, and copper leadframes, allowing flexibility in plating finishes. Good hot hardness promotes mold release, and a mold cycle of 4 minutes maximizes production throughput. It is suggested for various types of transfer molding and compression molding processes.

Contact our customer service department for more information or to request a sample.