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Optocouplers look simple from the outside, but inside, they are complex and even a bit fragile.
SolEpoxy proposes a set of just two epoxy composites that could make optocouplers better, easier to make, less prone to unanticipated failure, and cheaper, too.
OP60 is filled variant of our industry-standard, non-yellowing, clear epoxy molding compound. Optical-grade fillers reduce thermal expansion and moisture absorption while preserving translucence. MG6-1070 is a variant of our industry-standard, shock-resistant epoxy molding compound used for decades on power transmission gear and industrial devices. These two anhydride cured molding compounds are chemically and mechanically compatible.
- Low stress: direct-bond encapsulation of the emitter and sensor reduces cracking from thermal expansion when using our black over mold. Matching thermal expansions minimize product failure
- Excellent dielectric strength eliminates the need for Kapton inside the device.
- Reduced moisture absorption: Significant reduction in moisture absorption compared to traditional optical encapsulate epoxies to help meet the demanding MSL1 criteria.
- Arc Resistant: with a 600V CTI rating, the bond between MG6-1070 and OP60 prevents arcing along the inner and outer mold interface.
- Versatile and Efficient: Excellent adhesion to a variety of plating finishes. Rapid hot hardness combined with superior mold release allows for elevated production throughput.
Contact SolEpoxy for opto electronic molding compounds for optocouplers, LED emitters, light sensors, epoxy bandpass filters. Contact SolEpoxy for fine molding compounds for electronics, industrial devices, power transmission, and power electronics.
