MH20-2000 Very tough, high operating temperature epoxy mold compound for power resistors, switches, fuses, actuators, and explosion proof housings 
MH20-2000 is a very tough epoxy mold
compound with excellent high temperature resistance.
It is used in applications that require thermoset
epoxies instead of thermoplastics because of higher
performance requirements.
MG6-0330 Tough, high thermal shock epoxy mold compound for large bushings and other high voltage applications 
MG6-0330 is very tough epoxy mold compound with excellent thermal shock and thermal cycle resistance.
OL10-1 High refractive index liquid encapsulant for optoelectronic devices 
  • Outstanding resistance to yellowing after heat aging up to 105C
  • Suitable for through-hole, SMT, and MAP style packages
  • Can be used to replace expensive bandpass filters
MH6-0510 Very tough, high thermal shock epoxy mold compound for solenoids, coil bobbins, and transformers 
MH6-0510 is very tough epoxy mold
compound with excellent thermal shock and themal
cycle resistance.
OP1000 Heat and UV-resistant, optically clear molding compound for RBG devices and backlighting 
  • Resists yellowing up to 125C for thousands of hours
  • Glass transition temperature (Tg) > 135C
  • Diffused, colored and light filtering versions
OL88-8 High refractive index liquid encapsulant for optoelectronic devices 
OL88-8 is an ultra-clear hybrid liquid encapsulant developed specifically for outdoor RGB displays. It is uniquely suited for RGB SMT devices due to its very high adhesion to black-faced PPA packages and very low moisture absorption, able to pass -65C to 150C temperature shock cycles and 85C / 85% RH + 3x 260C reflow required for outdoor RGB SMT displays.
OP1000 Heat and UV-resistant, optically clear molding compound for RBG devices and backlighting 
  • Resists yellowing up to 125C for thousands of hours
  • Glass transition temperature (Tg) > 135C
  • Diffused, colored and light filtering versions
Analytical Laboratory 
The Analytical Laboratory supports the Product Development Laboratories and assists with the resolution of customer problem solving issues.We do Product Development Support,Support of Customer Issues, Product Testing and Raw Material Testing.
OL10-1 High refractive index liquid encapsulant for optoelectronic devices 
  • Outstanding resistance to yellowing after heat aging up to 105C
  • Suitable for through-hole, SMT, and MAP style packages
  • Can be used to replace expensive bandpass filters
OP1000 Heat and UV-resistant, optically clear molding compound for RBG devices and backlighting 
  • Resists yellowing up to 125C for thousands of hours
  • Glass transition temperature (Tg) > 135C
  • Diffused, colored and light filtering versions
MH6-0504 Very tough, high thermal shock epoxy mold compound for solenoids, coil bobbins, and transformers 
MH6-0504 is very tough epoxy mold compound with excellent thermal shock and thermal cycle resistance.
MG33F-0520 Fast Cure, solvent resistant epoxy mold compound for tantalum capacitors and reed relays 
MG33F-0520 is a fast cure, solvent resistant epoxy mold compound with excellent adhesion to copper substrates, used on high temperature applications requiring low stress and high thermal conductivity.
Epoxy Insulating Coating Powders 
  • Outstanding chemical resistance, including motor oil, fuel, etc.
  • Low coating thickness required to achieve maximum performance
  • Capability to provide a range of thermal conductivity
Durable Dielectric Molding Compounds 
  • Excellent Electrical Insulation
  • High Strength
  • Excellent thermal shock resistance