About Us 
Describe SolEpoxy
AL10-1 One-part epoxy solution to stainless steel brazing 

Key Application Considerations:

  • Very high adhesion to stainless steel and other metals
  • Balanced flow to get between joints yet not flow off
    them
  • CTE-matched to the substrates involved
MH20-01 Black Very tough, high operating temperature epoxy mold compound for power resistors, switches, fuses, actuators, and explosion proof housings 
MH20-01 is a very tough epoxy mold compound with excellent high temperature resistance. It is used in applications that use thermoset plastics instead of thermoplastics because of the high temperature requirements
MH20-01 Gold Very tough, high operating temperature epoxy mold compound for power resistors, switches, fuses, actuators, and explosion proof housings 
MH20-01 is a very tough epoxy mold compound with excellent high temperature resistance. It is used in applications that use thermoset plastics instead of thermoplastics because of the high temperature requirements.
MH20-0686 Black Epoxy Molding Compound 
MH20-0686 is a very tough epoxy mold compound with excellent high temperature resistance. It is used in applications that use thermoset plastics instead of thermoplastics because of the high temperature requirements.
MG33-0690 Black Epoxy Mold Compound 
MG33-0690 Fast cure, solvent resistant compound with superior copper adhesion for engine gear tooth and other automotive sensors
Busbar Patch Kits 

Key Application Considerations:

  • High dielectric strength
  • Applied as a liquid at room temperature
  • Color-matches the epoxy coating powder used
Adhesive Alternative to Brazing 

Key Application Considerations

  • Very high adhesion to stainless steel and other metals
  • Balanced flow to get between joints yet not flow off them
  • CTE-matched to the substrates involved
MH20-0686 Black Epoxy Molding Compound 
MH20-0686 is a very tough epoxy mold compound with excellent high temperature resistance. It is used in applications that use thermoset plastics instead of thermoplastics because of the high temperature requirements.
MG33-0690 Black Epoxy Mold Compound 
MG33-0690 Fast cure, solvent resistant compound with superior copper adhesion for engine gear tooth and other automotive sensors
Certifications 
List different Certifications
OC10-1 Heat-resistant, optically-clear molding compound for RBG devices & BLU 
  • Resists yellowing up to 125C for thousands of hours
  • Refractive index of 1.53 @ 400 nm
  • Excellent transmittance from 400 to 1400 nm
OL10-1 High refractive index liquid encapsulant for optoelectronic devices 
  • Outstanding resistance to yellowing after heat aging up to 105C
  • Suitable for through-hole, SMT, and MAP style packages
  • Can be used to replace expensive bandpass filters
OP1000 Heat and UV-resistant, optically clear molding compound for RBG devices and backlighting 
  • Resists yellowing up to 125C for thousands of hours
  • Glass transition temperature (Tg) > 135C
  • Diffused, colored and light filtering versions
OP7000 Clear molding compound for SMT light sensors and emitters 
  • Single-Mold Data Transmission Sensors
  • Excellent light transmission even after aging
  • Excellent MSL performance for single-mold devices